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The wire saw cutting machine is a device that utilizes high-strength wires (such as diamond wires, steel wires, resin wires, etc.) as cutting tools. Through the high-speed or reciprocating motion of the wires, it precisely cuts various materials. Its core advantage lies in its ability to achieve non-destructive/low-damage cutting of large-sized, complex-shaped, or high-hardness materials. It is widely applied i multiple fields, including semiconductors, photovolta ics, new materials, jewelry, and building stones.
1.Wide Material Adaptability: Capable of cutting almost all materials, ranging from soft plastics to ultra-hard diamonds, particularly excelling in hard and brittle materials (which traditional saw blades cannot efficiently cut).
2.High Cutting Precision and Low Loss: Diamond wire saws feature narrow kerfs and small dimensional tolerances, resulting in material utilization rates that are 10%-30% higher than those of traditional saw blades (e.g., in photovoltaic silicon wafer cutting, each silicon ingot can yield 5-10 more wafers).
3.Excellent Cutting Stability: Minimal vibration ensures a flat cutting surface, reducing subsequent grinding and polishing processes and lowering processing costs.
4.Complex Cutting Capability: The flexible wire enables cutting of curves and irregular shapes, meeting customized processing demands (e.g., irregular ceramic parts in the electronics industry).
Wire System:
Wire Spools (Feeding Spool + Take-up Spool): Store wires and control wire tension and speed.
Guide Wheel Set: Multiple high-precision pulleys (made of ceramics or hard alloys to reduce wire wear) guide the wire along a preset trajectory.
Tension Control System: Comprising tension sensors and servo motors, it adjusts wire tension in real-time to prevent looseness (causing cutting deviation) or tightness (causing wire breakage).
Worktable System:
Worktable Surface: Used to secure the material to be cut (via vacuum suction or clamps), typically made of stainless steel or granite for stability and reduced vibration.
Feed Mechanism: Driven by a servo motor and ball screw, it achieves uniform feeding of the worktable towards the wire, with adjustable feed speed (slow feed required for hard and brittle materials to avoid chipping).
Cooling and Lubrication System:
Cutting Fluid Tank: Stores cutting fluid (for cooling, lubrication, and carrying abrasives; diamond wire saw cutting fluid primarily cools, while steel wire saw cutting fluid primarily carries abrasives).
Spray/Immersion Device: Uniformly delivers cutting fluid to the cutting area to reduce temperature and wear.
Filtration System: Filters impurities from the cutting fluid (such as material debris and abrasive residues), extending the lifespan of the cutting fluid and wire.
Control System:
Operation Panel: Touchscreen or buttons for setting parameters (cutting speed, feed speed, tension), starting/stopping the equipment, and monitoring operational status.
Drive Module: Controls the operation of the feeding/take-up motors and worktable feed motors to ensure motion precision.
Alarm System: Automatically stops the machine and triggers an alarm when tension abnormalities, insufficient cutting fluid, or motor overload occur, preventing equipment damage or material scrap.
| Parameter | Description |
| Cutting Wire Type | Stainless steel or tungsten wire with diamond coating (diameter 0.2-0.5mm) |
| Wire Speed | 0-3 m/s (adjustable) |
| Cutting Feed Rate | 0.1-20 |
| Wire Diameter | 0.65 |
| Maximum Sample Size | 100mm x 100mm x 100mm (customizable) |
| Cutting Thickness Accuracy | ±0.1mm or higher |
| Cooling System | Water-based coolant/slurry tank with circulation pump |
| Power Supply | 230V/50Hz/Single Phase |
| Working Stroke | 350*400 |
Photovoltaic and Semiconductor Industries (Core Application Fields)
1.Photovoltaic Industry: Primarily uses "diamond wire saw cutting machines" to cut silicon ingots (monocrystalline/polycrystalline silicon) into 0.16-0.2mm thick wafers, a core processing step for photovoltaic modules. Current mainstream models support "large-sized silicon ingot cutting" (e.g., 210mm ingots) and are evolving towards "multi-wire cutting" (cutting multiple wafers simultaneously) to enhance productivity.
2.Semiconductor Industry: Employs "high-precision diamond wire saw cutting machines" to cut third-generation semiconductor substrates like silicon carbide (SiC) and gallium nitride (GaN), requiring cutting precision ≤±0.005mm and surface roughness (Ra)≤0.1μm to avoid affecting subsequent wafer processing (e.g., epitaxial growth).
Optical and Electronics Industries
1.Optical Field: Cuts sapphire (for mobile phone camera lenses, laser device windows) and quartz glass (for optical prisms, spectrometer components), ensuring a scratch-free and chip-free cutting surface to avoid compromising optical performance.
2.Electronics Field: Cuts ceramic substrates (for power semiconductor packaging), PCB circuit boards (irregular cuts), and silicon carbide power devices, requiring a dust-free and electrostatic-free cutting process to prevent damage to electronic components.
New Materials and Special Processing Industries
1.New Materials Field: Cuts carbon fiber composites (aerospace components) and metal-based composites (e.g., aluminum-based silicon carbide), addressing the issue of "interlayer delamination" in materials, typically using a "low-speed, low-tension" cutting process.
2.Special Processing: Cuts jewelry and gemstones (e.g., jade, Hetian jade) and artificial diamonds, employing "resin wire saws" or "fine diamond wire saws" for complex shape cutting (e.g., carving, hollowing); laboratory-scale small wire saw machines are used to cut metal/ceramic samples for subsequent microstructural analysis (e.g., metallographic examination).
Construction and Stone Industries
Primarily uses "steel wire saw cutting machines" to cut large stones ( e.g., marble blocks into slabs) and concrete structures (e.g., reinforced concrete cutting in bridge and building demolition), enabling "large-sized, deep cutting" (cutting depths up to several meters) and being more suitable for irregular stone processing (e.g., curved stone slabs) compared to traditional saw blade cutting.
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